Mechanical Eng Mgr - Architecture & Design - Product Design - Program/Project Management - PLC - People Management - Electronic Cooling - Manufacturing Processes - PCBA Mfg - Cost Cutting - IC packaging - CAD - BOM Structure - Statistical Tol Analysis - Interconnects - FEA - CFD - Plastic / Molding - Sheet Metal
Experience
2019 — Now
San Francisco Bay Area
Managing Product design, ID, Packaging, Usability & Sustainability
2018 — 2019
San Jose, California
Program manager working on high speed switches NPI products from initial design concept to EOL. This includes working closely with HW design, Mech design, ID, MDVT, EDVT, FW, Diags, Supply Eng, Procurement, Test Eng, Mfg NPI Eng, Document control, US/Asia/Mex CM's.
In charge of root causing & improving yields on major manufacturing concerns by organizing cross functional tiger teams thru out the organization.
2015 — 2018
2015 — 2018
Menlo Park, CA
Senior Principal Mechanical Eng / Thermal Eng
Mechanical / Thermal architect in charge of creating & implementing concepts for High-End & Mid-Range cost conscious NVMe Dell Storage systems.
Transferred future business requirements into highly efficient system designs in concert with HW system architects using Thermal & Structural analysis tools to optimize for cost, reliability & serviceability.
Interacted closely with ODM / JDM partners to design & release into production low cost storage systems.
Successfully architected a High End system & worked closely with JDM for release into production.
Dell / EMC Jan 2015 - March 2017
Senior Mechanical Eng Manager
Managed an inclusive & diverse group of 10 Mechanical Engineers and Product Designers in DSSD group, an acquired start up. Delivered a custom flash appliance & SSD scaling up to but not limited to 288TB of flash storage in 5RU @ 100 GB/s.
Implemented mechanical design & testing processes for both NPI & sustaining projects.
Worked closely with CM’s to improve their processes to achieve higher quality products.
Redesigned a high speed custom connector to be used for both copper & optical interconnect to substantially improve quality & reliability.
2013 — 2015
San Jose, CA
Built a new diverse team of 18 engineers responsible for mechanical product design, thermal & structural (FEA) analysis and testing, industrial design, human factors / user interface, MDVT & sustaining.
Initiated a product design process for each stage of design, from concept to full production including but not limited to FEA Analysis, prototyping, concept verification, design best practices, user interface studies, Statistical Tolerance Analysis, drawings, DFM, Mold Flow & tooling bring up.
Managed multiple simultaneous (~14) NPI projects with a mix of high volume cost sensitive and low volume high margin products. Responsible for both internal and external design of all the related mechanical parts and assemblies managing closely with JDM’s, OEM’s, CM’s.
Personally lead a storage product design using outside design firms to meet the schedule goal because of internal resource shortages.
Invested in team member’s technical growth and career aspirations by mentoring and implementing career development opportunities with emphasis on benefiting the team.
Created simple & clear SOW & RFQ templates for standardizing our interactions with outside design firm partners.
Developed appropriate specifications and test procedures / DVTs as necessary to ensure desired reliability and performance of product.
Mechanical program manager of all projects within the Mech team, in charge of schedule, cost target, resourcing, interacting closely across the engineering organization and manufacturing. Communicating closely with the offshore suppliers and EM’s.
2010 — 2013
2010 — 2013
Santa Clara, CA
• Managed an Engineering team of 14 thermal, mechanical engineers, product designers and technicians responsible for Oracle's x86 Rack Mount, Blades & Storage product line.
Managed New Product Introduction, Sustaining projects and lead group working with external design houses. Interacting closely with CPU suppliers such as Intel, Connector suppliers, Industrial Design, HW Engineers, Compliance, Packaging, Marketing, Tech Pubs, Service and Far East Contract Manufacturers.
Member of architectural team. Working closely with Engineering VP's & CTO in new product definition & architecture of X86 group Servers & Storage Enclosures, Power Supplies, Racks, Interconnects & Cooling.
Initiated a companywide Mech Eng Seminar on various advanced Electro-Mechanical, Thermal and Manufacturing topics.
Project Managed two NPI systems simultaneously in addition to managing the Mechanical Eng Group. This effort included managing resources, cost and schedule of the entire systems from initial concept thru product life cycle.
Expanded group function to include Structural FEA, Thermal & Fluid analysis, Statistical Tol analysis, advanced experimental capabilities such as HDD Rotational Vibration measurement, PCB strain gage testing.
Education
University of California, Berkeley
PhD
University of Wisconsin-Madison
Bachelor of Science - BS
University of California, Berkeley