# Ehsan Ettehadieh > Senior Product Design Engineering Manager at Cisco Meraki Location: United States, United States Profile: https://flows.cv/ehsanettehadieh Mechanical Eng Mgr - Architecture & Design - Product Design - Program/Project Management - PLC - People Management - Electronic Cooling - Manufacturing Processes - PCBA Mfg - Cost Cutting - IC packaging - CAD - BOM Structure - Statistical Tol Analysis - Interconnects - FEA - CFD - Plastic / Molding - Sheet Metal ## Work Experience ### Senior Product Design Manager @ Cisco Meraki Jan 2019 – Present | San Francisco Bay Area Managing Product design, ID, Packaging, Usability & Sustainability ### Program Manager Eng Consultant @ Arista Networks Jan 2018 – Jan 2019 | San Jose, California Program manager working on high speed switches NPI products from initial design concept to EOL. This includes working closely with HW design, Mech design, ID, MDVT, EDVT, FW, Diags, Supply Eng, Procurement, Test Eng, Mfg NPI Eng, Document control, US/Asia/Mex CM's. In charge of root causing & improving yields on major manufacturing concerns by organizing cross functional tiger teams thru out the organization. ### Senior Mech Eng Mgr / PM @ Dell EMC Jan 2015 – Jan 2018 | Menlo Park, CA Senior Principal Mechanical Eng / Thermal Eng Mechanical / Thermal architect in charge of creating & implementing concepts for High-End & Mid-Range cost conscious NVMe Dell Storage systems. Transferred future business requirements into highly efficient system designs in concert with HW system architects using Thermal & Structural analysis tools to optimize for cost, reliability & serviceability. Interacted closely with ODM / JDM partners to design & release into production low cost storage systems. Successfully architected a High End system & worked closely with JDM for release into production. Dell / EMC Jan 2015 - March 2017 Senior Mechanical Eng Manager Managed an inclusive & diverse group of 10 Mechanical Engineers and Product Designers in DSSD group, an acquired start up. Delivered a custom flash appliance & SSD scaling up to but not limited to 288TB of flash storage in 5RU @ 100 GB/s. Implemented mechanical design & testing processes for both NPI & sustaining projects. Worked closely with CM’s to improve their processes to achieve higher quality products. Redesigned a high speed custom connector to be used for both copper & optical interconnect to substantially improve quality & reliability. ### Mechanical Engineering Mgr Data Center Group / PM @ Cisco Systems Jan 2013 – Jan 2015 | San Jose, CA Built a new diverse team of 18 engineers responsible for mechanical product design, thermal & structural (FEA) analysis and testing, industrial design, human factors / user interface, MDVT & sustaining. Initiated a product design process for each stage of design, from concept to full production including but not limited to FEA Analysis, prototyping, concept verification, design best practices, user interface studies, Statistical Tolerance Analysis, drawings, DFM, Mold Flow & tooling bring up. Managed multiple simultaneous (~14) NPI projects with a mix of high volume cost sensitive and low volume high margin products. Responsible for both internal and external design of all the related mechanical parts and assemblies managing closely with JDM’s, OEM’s, CM’s. Personally lead a storage product design using outside design firms to meet the schedule goal because of internal resource shortages. Invested in team member’s technical growth and career aspirations by mentoring and implementing career development opportunities with emphasis on benefiting the team. Created simple & clear SOW & RFQ templates for standardizing our interactions with outside design firm partners. Developed appropriate specifications and test procedures / DVTs as necessary to ensure desired reliability and performance of product. Mechanical program manager of all projects within the Mech team, in charge of schedule, cost target, resourcing, interacting closely across the engineering organization and manufacturing. Communicating closely with the offshore suppliers and EM’s. ### Senior Mech Eng Mgr @ Oracle Jan 2010 – Jan 2013 | Santa Clara, CA • Managed an Engineering team of 14 thermal, mechanical engineers, product designers and technicians responsible for Oracle's x86 Rack Mount, Blades & Storage product line. Managed New Product Introduction, Sustaining projects and lead group working with external design houses. Interacting closely with CPU suppliers such as Intel, Connector suppliers, Industrial Design, HW Engineers, Compliance, Packaging, Marketing, Tech Pubs, Service and Far East Contract Manufacturers. Member of architectural team. Working closely with Engineering VP's & CTO in new product definition & architecture of X86 group Servers & Storage Enclosures, Power Supplies, Racks, Interconnects & Cooling. Initiated a companywide Mech Eng Seminar on various advanced Electro-Mechanical, Thermal and Manufacturing topics. Project Managed two NPI systems simultaneously in addition to managing the Mechanical Eng Group. This effort included managing resources, cost and schedule of the entire systems from initial concept thru product life cycle. Expanded group function to include Structural FEA, Thermal & Fluid analysis, Statistical Tol analysis, advanced experimental capabilities such as HDD Rotational Vibration measurement, PCB strain gage testing. ### Mech Eng Mgr @ Sun Microsystems, Inc. Jan 1995 – Jan 2010 | Menlo Park, CA Directed cross functional resources, budgets & projects on Revenue/NPI servers with focus on resolving CPU & HDD roadmap challenges, design feature and substantial thermal/cooling enhancements, 2nd sourcing, DFx, cost reduction efforts. Lead $100M+ quality & revenue challenges demonstrating past proven record of working extremely well under pressure and capability to make difficult program decisions. Created new processes using FEA / CFD analysis & experimentation to enable rework of multiple BGA ASICs simultaneously, resulting in recovery of $20M worth PCBA’s. Received best manager achievement rating based on technical ability, interpersonal relationships and group (20 directs) leadership. Lead a small group of FEA analyst supporting across all the engineering organization. ### Thermal / Structural FEA Lead @ Sun Microsystems Inc. Jan 1990 – Jan 2005 | Santa Clara, CA • Thermal Eng in charge of Sun Sparc processor cooling across platforms. • Modified Sun's existing servers to have redundant & optimized cooling. • Worked closely with the processor group, Texas Instruments & system hardware engineering to meet Sun's processor roadmap. • Lead a small group of Mechanical analysts. Responsibilities of the group included selection of analysis codes, maintenance & consulting services across the company. ## Education ### PhD in Mechanical Engineering University of California, Berkeley ### Bachelor of Science - BS in Mechanical Engineering University of Wisconsin-Madison ### Doctor of Philosophy - PhD in Mechanical Engineering University of California, Berkeley ## Contact & Social - LinkedIn: https://linkedin.com/in/ehsan-ettehadieh-b1a41b2a --- Source: https://flows.cv/ehsanettehadieh JSON Resume: https://flows.cv/ehsanettehadieh/resume.json Last updated: 2026-04-13