• Managed collaboration and communication with internal and external teams for AR/VR products in emerging markets.

• Developed comprehensive product roadmaps by gathering insights from the marketing team and providing feedback to development teams.

• Delivered multiple Sony IMX image sensor products from concept through tape-out, chip-up, and silicon evaluation, driving cross-functional execution across architecture, VLSI design, verification, CAD, and system teams.

• Drove full Architecture -> RTL -> Verification -> Physical Implementation (Placement and routing) -> Tape-out -> Chip-Out -> Validation -> Silicon Bring-up lifecycle across globally distributed engineering teams

Responsible for development of design and verification plan and strategy for image sensor for a product cycle.

• Responsible for managing team of engineers explaining the specification, doing task and resource allocation and monitoring progress.

• Responsible for creating schedule and milestones for the team and and aligning with cross-functional teams.

• Business plan development for the sensor being developed defining the use case and arranging for the demo for the future customers.

• Laser driver IC development for TOF image sensors.

• Supported the team in Belgium with the Sony design flow followed in Japan.

• Managed team of 3 in Japan for development of Temperature sensors, LDO's and BGRs. by providing specifications, monitoring task and schedule.

• Worked in the development of Next generation image sensor in Sony Japan development headquarter.

• Designed Mixed Signal section of CIS Image sensor and created test cases for verification of the former.Led out new circuitry and test blocks to improve the yield of Image sensor.

• Demonstrated at open house and internal development exhibitions the high speed full stacked image sensor.