Enabling DataCenter AI/ML GPU, Consumer Electronic SoC, wearable device, Internet of thing (IoT) and Smart Energy Management applications through Advance Semiconductor Design: Chiplet+Processor+Sensor+Wireless Network.

Experience

UnknownPrincipal Consultant

2023 — Now

I provide IP, SoC, technology, advanced packaging, DTCO/STCO and phase gate methodology consultation services

I also participate some angel investment opportunities

CHINESE INSTITUTE OF Engineer/USA San FransciscoMember Board Of Directors

2021 — Now

United States

Chinese American Semiconductor Professional AssociationBoard of Volunteer

2006 — Now

Special Interest Group and Seminar (mobile Processor, Auto IC, CleanTech and New Energy)

Business Development

Have been a CFO, Board of Director, hosted Symposium and Seminars.

Amazon Lab126Sr IP and SoC Technical Program Manager

2022 — 2023

United States

Arm Core, Security, Crypto, Display, Video, uController, ISP IPs management

Next generation SoC management

AMDSenior SoC and Chiplet Engineering Program Manager

2013 — 2021

Sunnyvale, CA, USA

SoC Program Management, design methodology, milestones/checkpoints and design maturity.

IP management - core, foundation, mixed mode, connectivity and multimedia IPs

Cross Functional management, partnership, interlock, communication and bridging.

Advance 5nm, 7nm, 12nm and 14/16nm technologies.

Fanout and CoWoS 2D/2.5D/3D advanced packaging Technologies

Silicon area reduction and cost saving analysis.

Education

CALMAT

MBA

National Cheng Kung University

B.S. Engineering

UC Santa Barbara

Experience+9

Education

MBA

B.S. Engineering

M.S.

Experience