Defined power grid and PDN signoff methodology and flows for next-generation CPU clusters (3nm/2nm), enabling consistent execution by multiple internal teams.

Led methodology deployment across US and India teams, PDN analysis and physical design engineers on standard practices and flows.

Directed vendor evaluation and engagement to ensure tooling supported project requirements and advanced-node process rules.

Partnered with internal stakeholders to identify risks, recommend mitigation strategies, and standardize signoff best practices, reducing potential tapeout issues.

Built and scaled global product engineering teams (US, India, China, Taiwan, Korea) responsible for deployment, benchmarking, and customer enablement of Voltus platform.

Owned multi-generation product and deployment roadmap, aligning R&D, field, and strategic customers to deliver tapeout-critical signoff capabilities.

Served as primary executive interface for customers and foundries, managing escalations, certifications, and risk mitigation.

Drove methodology and flow adoption for N3/N5/N7/3DIC designs, resulting in improved first-pass signoff success and reduced design iterations.

Built and scaled high-performing engineering teams across APAC to deploy Voltus EM/IR signoff methodologies at major semiconductor customers (Samsung, TSMC, TI, NXP, ARM, GlobalFoundries).

Led methodology definition, early adoption, and benchmarking, establishing processes that later supported global rollout and multi-generation programs.

Partnered with field and customer teams to standardize power, EM/IR, and thermal signoff practices, ensuring consistent, reliable design results.

Directed competitive evaluations and provided actionable feedback to R&D for tool enhancements and feature prioritization.

Achieved multiple foundry certifications (28/20/16nm) and enabled broader product adoption across customer portfolios.

Validated PCB modules and system integration for EPABX and UHF/microwave radio platforms.

Supported end-to-end product testing, troubleshooting, and quality assurance for telecom hardware.