Conducted failure analysis on 3D and 2D SLC/MLC/TLC NAND Flash Memory and Embedded IOS and SSD products.

• Focused on solving complex problems by non-destructive electrical tests.

• Driving root cause of failures and associated corrective actions in component production and qualification flows.

• Developed and Implemented stresses and screens for early life failure to reduce ELFR below 100 DPPM

• Defined and improved testing methods to address new product characterization and qualification issues

• Performed risk assessment.

Managed a multidisciplinary team to deliver NAND and embedded products to one of the world most demanding OEM customer with improved processes and consistent delivery of schedules and world class quality, yield and test time. Managed a team of 7 engineers.

Conducted NAND and Product and Test solutions from Die Sort to all final products including wafers, packaged memory, USB, SD/USD, mobile and embedded MCPs. Coding NAND test sequence on bench tester.

Product, test, characterization and yield engineering support of NAND, Multi-Levels-Cell. NOR MPF, Flash Bank, LPC, Intel FWH & MTP products developed with 0.33um, down to 0.12um technologies at various foundries.