Led and completed the packaging design for ARM’s first computing chip

Collected and established package design rules

Optimized the BGA ball pattern

Led and completed the MTV package design for the next-generation product

Package development for Power IC

> monolithic MIS package development

> DrMOS Package Development

> Board Level Reliability test for Automotive parts

New Package Development for

> monolithic MIS Package

> BGA packages for ASIC

Support Customer's Pathfinding and new Package substrate development.