# neo zhang

> Package Design Engineering

Location: Sunnyvale, California, United States
Profile: https://flows.cv/neozhang

## Work Experience
### Package Design Engineer @ Broadcom
Jan 2026 – Present | San Jose, CA

### Package Design Engineer @ Arm
Jan 2024 – Jan 2026 | Chandler, AZ
Led and completed the packaging design for ARM’s first computing chip
Collected and established package design rules
Optimized the BGA ball pattern
Led and completed the MTV package design for the next-generation product

### Principal Package Developement Engineer @ Alpha & Omega Semiconductor
Jan 2023 – Jan 2024 | 美国 亚利桑那州 钱德勒
Package development for Power IC
> monolithic MIS package development
> DrMOS Package Development
> Board Level Reliability test for Automotive parts

### Package development engineer @ 安森美半导体
Jan 2023 – Jan 2023 | United States
New Package Development for

> monolithic MIS Package
> BGA packages for ASIC

### Principle Technical Marketing Engineer @ Samsung Electro-Mechanics
Jan 2022 – Jan 2023 | 美国 Arizona 凤凰城
Support Customer's Pathfinding and new Package substrate development.

### Sr. Design Manger @ Amkor Technology
Jan 2015 – Jan 2022 | TEMPE, AZ
Relocated to AMKOR U.S
1.	Establish and manage the strategic goals of the design team, ensuring that customer requirements are met. This involves interacting with key decision makers of internal and external customers as well as interacting with the factory, Product Group, and Sales Teams
2.	Coordinate with each customer assigned to him and prepare a package design according to the specifications of the customer. 
3.	Assigns designs to different design teams who he selects from one of Amkor’s 4 overseas design centers to complete all the tasks in a timely manner. 
4.	Work directly with each Amkor Design Center in China, South Korea, the Philippines, and Taiwan to distribute the workload and ensure a timely delivery to customers. 
5.	Strategically position Amkor for generating design wins by managing technological issues on package designs in support of the sales team for all new key products
6.	Functionally oversee teams who handle the detailed mechanical support designs and drawings for assigned accounts.
7.	Functionally oversee documentation and ensure customer satisfaction by driving improvements, providing consistent feedback and direction to Amkor and its factories

### Sr Design Manager @ Amkor Technology
Jan 2005 – Jan 2015 | Shanghai, China
The head of Amkor China design team
Worked as a FOL PE(Front Line Process Engineering) manager for one year during CDP（career development program）.

>setup electrical co design capability(2014)
introduced design capability of : 
Bumping & WLP design(2013)
fpfc + PoP FC design (2012)
FCCSP (2010)
ODP,HDDP(16X die stack) (2010)
ILT TSOP(2009)
SIP & Memory Card Design(2006~2008)
Setup ATC design Team(2005): PKG: CSP/PBGA/TSOP/QFN/LGA...etc

### Package design Manager @ STATS ChipPAC
Jan 2003 – Jan 2005 | shanghai, China
Design manager of STATS ChipPAC CHina
Setup Laminate package design capability of SCC(Stats Chippac Shanghai)
Introduct Memory Card design capability
PBGA;CSP;SBGA, etc.

### NPI engineer/ designer Manager @ ASE Group Global
Jan 2000 – Jan 2003 | Shanghai
Join in GAPT ASE as a NPI engineer 
Start package design in China Mainland as a pioneer designer.
Was promoted as a Design manager after several sccuessed NPI projects.
Various Package design: PGBA(North/South Bridge); CSP; Stack CSP; QFN; TSOP;QFP;PLCC.FCBGA etc


## Education
### 工程硕士(Master of Engineering) in Semiconductor Industory
Fudan University

### Bachelor's degree in Heating and Ventilation
University of Shanghai for Science and Technology

### 2nd Major in , Computer Sciense
University of Shanghai for Science and Technology


## Contact & Social
- LinkedIn: https://linkedin.com/in/neo-zhang-927a4b23

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Source: https://flows.cv/neozhang
JSON Resume: https://flows.cv/neozhang/resume.json
Last updated: 2026-04-13