Sunnyvale, California, United States
• Collaborate with chip (PIC) design engineers to understand wafer processing requirements
• Collaborate with tool engineers to understand tool behavior and process requirements in various areas like EPI, Photo, Plasma, Wet, Assembly and Test.
• Develop software solutions and tools to automate and monitor the manufacturing process
• Identify opportunities for efficiency by developing software solutions
• Prepare requirements documents for developing and enhancing MES and software applications
• Prepare software solution and design documents
• Implement software solutions and applications to support PIC manufacturing process
• Some key software tools developed :
* Wafer and die layout design tool that read and write GDS file as inputs and output
* Automatic photo stepper job (recipe) generator for ASML tool
* Visual defect tracking, visualization and analysis
* EPI growth process planning, design automation, recipe generation and data analysis
* Wafer processing tool data parsing, collecting and visualization
* MES modules (tool dispatching, configurable event-action, SPC, wafer Yield prediction, PM )
• Testing software applications with tool engineers / operators in production (FAB)
• Manage and implement software solution to drive SPC for PIC manufacturing processes
• Architect and develop MES modules used in PIC manufacturing
• Develop and maintain parts of MES business logic using PL/SQL
• Database table design for MES
• MES modules (tool dispatching, configurable event-action, SPC, wafer Yield prediction, PM )