Develop company-wide product Roadmap.

Develop MRD,PRD and SoC (System-on-Chip) integration and ASIC design roadmap for next-gen storage solutions.

Define low-power architecture, optimizing clock, power, and voltage domain management.

Lead the product modeling platform with a focus on performance analysis and power modeling using SystemC.

Oversee Network-on-Chip (NoC) implementation and integration of on-chip interface protocols (AMBA AXI, OCP, ONFI, JEDEC).

Manage third-party IP engagement.

Seamless cross-functional collaboration across global teams.

Led Micron's Internal SSD Controller Architecture

Defined SSD controllers for Client OEM and Datacenter Cloud Segments

Developed Quality of Service (QoS) strategies for enterprise and cloud workloads.

Optimizing cache design and DRAM performance for high-performance storage.

Set processes for successful multi-Functional teams engagement across international sites.

Drove performance and power optimization, aligning firmware and hardware teams on efficiency goals.

Collaborated with design teams on on-chip interface protocol implementation (AMBA AXI, ONFI, DDR, I3C).

Worked on new products definition upcoming media technology like 3DX Point .

Exercise tightly integrated working style across Design and Firmware Teams to enable working products with realistic schedules.

Tidal Systems was among the first startups to adopt the NVMe interface during its early standardization phase. The company was later acquired by Micron Semiconductor in a multimillion-dollar deal for its first SSD controller silicon, which was successfully productized under the Micron brand.

Founding Member and key contributor to technology and product strategy.

Led ASIC Architecture, driving innovation in SSD controller design.

Spearheaded Product Modeling, identified bottlenecks and controller features to achieve Datacenter QOS Targets.

Provided early product marketing and business development support, facilitating technical engagements with partners and investors.

Hands-on Designer and lead to critical proprietary company IPs.

 Setup Platform Hardware and Software to enable On-Site Automated Flash Characterization

 Customer interface for all NAND vendors including Samsung, Micron, Toshiba and Hynix

 Cycle through various conditions for Nand Devices to study Noise and Characteristic under various retention and endurance conditions.

 Assist the development and implementation of various DSP algorithms cater towards MLC and TLC Nand devices.

Delivered Multiple Product across

• Client OEM value segments,

• High-performance enterprise storage solutions.

• Cost Sensitive Mobile-OEM segment, balancing affordability with reliability.

 Project Owner/Manager and Architect for the eMMC LDPC Nand Flash Controller, driving SoC design and integration.

 Responsible for customer engagement, technical and product definition.

 Developed innovative low-power solutions by defining analog IPs addressing challening Low power targets in emmc storage controllers.

 Involved in FW algorithm development including Flash layer Management, power interrupt schemes and workload dependent optimization.

 Led cross-functional teams of 20+ engineers across design, verification, firmware, and ASIC P&R to deliver high-quality silicon on schedule.

 Communication with Fab partner NEC and customer for pad, packaging and wafer probing strategies to enable multi Die packaging solutions.