• Sensor fusion, camera and system architecture

• D/C-PHY link design, optimization and development

• <0.5pJ/bit Chiplet Die to Die design, development and implementation

• Customer and system focused design wins, definition of roadmap devices and core architecture for FPD-Link Automotive PHY IV, IV+), fab and technology selection

• Design and product director responsible for product enablement from definition phase, pkg. selection and silicon tape out to silicon validation and customer enablement for FPD-Link ADAS and IVI

• Targeted architecture for high-performance sensor/Display-Cable gearbox including

• CSI C/D-PHY, etc. link interfaces

• Silicon Design for Advanced Display Interconnect Technologies

• Smart sensing and compensation for next generation 120Hz Displays

Focused product development and marketing collaboration from MRD to system definition, sub-block specifications and deployment to internal design teams. Development and productization of DR4 modules and 112Gbps+ ADC/DAC-DSP solutions:

• Highly visible role of co-designing with external customers, and delivery of internal and external executive updates

• Leading AMS circuit and system design team:

Architecture and GDS delivery in AFE for 112Gbps+ ADC/DAC-DSP solution in single lambda products

• Major AFE re-architecture and silicon execution boosting JTOL margin and enhancing BER by 10x

• 28Gbps+ serdes development

• Sub-200fs/ low jitter and SONET compatible wide-band fractional synthesizer, digital PLL

• High performance digital CDR with improved INL