# Rubén Peña > Principal Forward-Deployed Technologist Battery CameraModule OLEDdisplay SoC ProjProgMgr PMP MM-AI GEN-AI ML LLM Reliability QA Test-EcoSystem Forensic-Autopsy Failure-Analyst Statistics BigDataAnalystScientist Mfg R&D Location: Mountain View, California, United States Profile: https://flows.cv/rubnpea 🌺¡Aloha!🌺I'm excited about STEM Science Technology Engineering Math & I Love what I do! ►EXPERIENCE ♦PRO-DATA, INC. - ENGINEERING SOLUTIONS; NY, NY ‘09~now ♦TESLA; Fremont, CA ‘20 ♦LOCKHEED-MARTIN SPACE-SYSTEMS; Sunnyvale, CA ‘06~’08 ♦MICROJET/JP TECHNOLOGIES; Taiwan, R.O.C. ‘02~’06 ♦AGILENT TECHNOLOGIES; Spin-Off of HP; Santa Clara, CA ‘00~’01 ►SKILLS ♦AI Gen-AI MM-AI ML LLM integrated strategically into roles delivering better products & faster more accurate efficient productive insightful/intelligent results & more profits to Clients/Customers ♦HandsOn polyglot Sr PMP/Engineer-Mgr 10+ years Domestic/Intl. experience creating tech innovation & added value: NewProductDesign/Develop Reliability/QA Test FailureAnalysis ForensicAutopsy VerificationValidationQualification of Camera-Mod Battery OLEDdisplay SoC MEMS/Nano SystemsEng R&D Mfg Marketing HW/SW & Project Execution ♦Tenacious ability to brainstorm & implement “OutOfTheBox” ideas till Objectives are met ♦Superior Engineering skills finding novel ways to ProblemSolve & TroubleShoot Design Development Test Reliability QA Mfg & Yield enhancements ♦TimeProven ability to deRisk Client's investments & MultiTask-Streamline deliverables at Scale w Efficiency Productivity Revenue Profit ♦Proven experience in Product Methodology: Concept R&D Design Prototype Test ExtremelyHighVol Mfg Market-Intro & Product Support ♦Effective interpersonal skills with all levels of Mngmnt & Customers in global geographies ♦Motivator Leader Collaborating Influencing across CrossOrg boundaries ♦Expert SynthesizingResources MotivateTeams EnergizeIndividuals’ Enthusiasm to Engage Projects Proactively, Maximizing Contributions creating “Success Minded” Org to deliver Objectives & AddValue ♦Proposal Writing/Presentations/Public Speaking to Govt seeking Grant Capital @ StartUps ►GOALS ♦Engaged Contributor ready to join a high growth visionary Org w novel & stimulating assignments using my broad/diverse Experience Qualifications Education TechnicalAbility & People Leadership skills to bring InnovativeRobust HighTech Products & Services to Customers efficiently successfully to improve Life in harmony w Earth ♦Value working in Unison-Harmony between Business STEM & Nature to achieve Mutual Beneficial Goals ♦Community Leader promoting sustainable stewardship/harmony between People & Nature, strengthening Cultural/Spiritual connections ♦Promote respect of Hawai'ian Aina ♦Akua Ho'omaika'i Hawai'i ♦Que Viva Puerto Rico y España ## Work Experience ### Sr SmartPhone Wearable BatteryCAModuleOLEDisplay RelQATestFA AIdataAnalysis ForwardDeployedEng/PMP @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, NY ► Principal Forward-Deployed Engineer Technologist Battery OLEDdisplay CameraMod SoC ProjProgMgr-PMP MM-AI GEN-AI ML LLM Reliability QA TestEcoSystem ForensicAutopsy FailureAnalysis BigDataScientistAnalyst Statistics ♦ Electro-Mech Systems Engineer in Robotics Mechatronics Design for eXcellence Vendor-CM R&D & High-Volume-Precision-Mfg ♦ Auto-Test-Systems: GBIP VME cPCI PXI MatLAB LabVIEW VXWorks CVI UNIX LINUX X-Windows LMSTAR file-structure permission-settings script-batch-files ♦ Tolerance-Stack-up MiniTab JMP Six-Sigma +/-3s Cp/Cpk SPC MTBF FIT Kaizen/Taguchi GageR&R ♦ Environmental/Weather/Climatic Tests: T-Vacuum/T-Cycle/T-Shock Acoustic/Shock/Drop/Tumble/3-axis-Vibe HALT/HASS Mass-Properties Static/Dynamic-Load Accelerated-LIFE(Temp-%RH-Time via Arrhenius-Model) EMI/EMC Archival-Test IR+UV-Aging Abrasion/Corrosion/Dust/Rain/Salt/Fog Pres/Temp/%RH/Alt in ESS Chamber ♦ HP/Agilent Infinium T&M Surface-Analysis-Chemical-Detect Metrology ♦ C C# C++ Obj-C Python HTML CSS JavaScript Flash SQL XML ♦ VersaCAD MathCAD AutoCAD2000 ME30 ProE Solidworks SDRC I-DEAS ANSYS CADAM-CATIA ♦ Android iPhone iPad iPod Tablet MobileApp ♦ ISO ASQ ANSI ASTM IEC IEEE JEDEC MIL-SPEC MIL-STD CQE CRE ♦ Bluetooth Wi-Fi Wireless-USB InfraRed 802.11 ♦ Oracle Informix SAP EPDM LiveLink WinOS 95/98/NT/2000/XP/Vista/7/8/10/11 ♦ GOOGLE-Analytics MS-Suite MSproject MSexcel/Macros/PivotTables VisualBasic MSaccess InfoAccess ♦ Product/Process Develop & Design; IC CleanRoomFAB Si ThinFilm Characterization Material-Science dryEtch wetEtch VLSI MEMS/Nano DevicePhysics ♦ Audio+Video CODECS ♦ ADOBE Acrobat Photoshop Illustrator Dreamweaver ♦ 1) Patents Pending in novel blockbuster Disruptive Technologies; Photovoltaics Batteries Thin-Film-Electronics Robotics-Mechatronics MEMS-Nano 2) Expert Linguist in Technical Engineering & Scientific Document Translation Verification 3) Staying current in latest Technology via Courses/Certs ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Sr Lead Mfg. Test-EcoSystem Design QA FA Data-Analytics Engineer; @ SmartPhone OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, NY ► Sr. Technologist - Reliability Test-Ecosystem Quality Failure-Analysis Data-Analytics Engineer+Manager for major Smartphone OEM (via PRO-DATA, INC. - Engineering Solutions) ► Sr. Lead Consultant Liaison between (local US-based) HW/SW Design Teams & (overseas WorldWide) Mfg. Operations teams. Excellent Project Mgmt. & People Mgmt. skills working w/ diverse groups at multiple OEM WW geographic locations & mfg. Operations in: Vietnam, China, India, Brazil, Indonesia & South Korea. ♦ “Guaranteed Availability” – respond “within 30 min” (by phone) to any issue regarding: Mfg. / Test / QA / Reliability during Mfg. scale-up / ramp-up for any of OEM’s mobile smartphone products & respond “within 72 hrs” (in person, if necessary) on the OEM factory floor in Vietnam, China, India, Brazil, Indonesia or S. Korea. Frequent travel to WW Mfg. & Test sites at Contract Manufacturer (CMs) overseas to work face-to-face w/ overseas Operations & Test Engineering teams at key points in product development life-cycle. Responsible for driving QA/Reliability testing activities at CMs overseas. Interacted with diverse US-based and Overseas groups to improve product QA & Reliability of OEM’s mobile smartphone products. ♦ Responsible for Verification/Validation/Qualification via Reliability/QA/Test in the Development & Integration solutions of Electro-Mechanical hardware, new materials & process, embedded mobile systems design 3GLTE, Wi-Fi, Bluetooth & GPS wireless connectivity; displays; haptics; sensors; memory; power supply; camera; battery; Electro-Mechanics & Printed Circuit Boards (PCBs rigid, flex, hybrid circuit boards, etc.), MEMS System-On-Chip (SoC), integration into small enclosures of consumer mobile products. ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Sr Lead Product Coordinator, Audit Test FA & Forensic-Autopsy Dept @ SmartPhone OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, New York, United States ► Sr. Technologist - Reliability Test-Ecosystem QA Failure-Analysis Data-Analytics Engineer+Manager @ Smartphone OEM (via PRO-DATA INC. - Engineering Solutions) ► Sr. Lead Product Test Coordinator of “Audit Test Failure-Analysis Forensic-Autopsy Dept.” with Mfg. Ops. in Vietnam China India Brazil Indonesia & S. Korea. ♦ Audit-sampled SmartPhones & Graphene-assisted Lithium-Ion Batteries & MEMS SoC components from OEM Mfg. & from Customer-Returns/Field-Failures from Field Safety Engineers then “hands-on” tested probed & reversed engineered via tear-down for design &/or mfg. issues as well as for safety/performance. The BMS: Battery Mgmt. System (protection of circuits) is also tested & evaluated for battery functionality integrity & robustness. Submit “failed” & “control” samples to Chemical Analysis Lab for Chemical-Detection/Surface-Chemistry-Analysis (of contaminant Organic Trace Compound Elements &/or Molecules) as well as for retrieving X-Ray & CT-Scan (Computed Tomography Scan) of “failed” & “control” units comparison, for review/analysis & for “Failure / Forensic Analysis Reports”. ♦ Brainstormed FMEAs: Failure Modes & Effects Analysis to identify categorize & assign risks of potential Failure Modes. ♦ Statistical Analysis: Weibull++ Correlation-Techniques Factorial-&-Time-Series-Analysis Excel JMP MathCAD Mathematica MS-Access/Info-Access Tableau, use of Accelerated Test models & DOE. ♦ Testing & Failure Analysis of Smart-Phones & Graphene-assisted Lithium-Ion Batteries & MEMS SoC devices from OEM Mfg. Failures & from Customer Field Failures to determine Root Cause. ♦ Prepared concise & detailed Test Plans, executed Testing/Failure Analysis & analyzed Test Data of Smart-Phones & Graphene-assisted Lithium-Ion Batteries from OEM Mfg. & from OEM Field Failures in order to determine Root Cause of failures, then presented “Testing / Failure Analysis / Forensic Analysis Report” results. ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Principal Mfg./Test/Design/FA-Engineer; Battery OLED-Display Camera-Module @ Smartphone OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, New York, United States ► Sr. Principal Technologist: Reliability TestEcosystem QA FA DataAnalytics Engineer+Manager for Battery/OLED-Display/Camera-Module @ Smartphone OEM (via PRO-DATA INC. - Engineering Solutions) ► Sr. Consultant Liaison between US QA Engineers Mgrs. HW/SW-Design-Teams Release-Engineers vs. overseas OEM CM Mfg Ops teams. Excellent Project/People Mgmt skills w/ diverse groups @ multiple OEMs' WW locations & Mfg Ops in Beijing Singapore Brazil & India. ♦ Chemical-Detection/Surface-Chemistry-Analysis of Organic trace compound molecules & thin-films: OSM Optical Shearing Microscopy; CT Computed Tomography Scan; EDS(EDX) Energy-Dispersive X-Ray Spectroscopy; XMA Electron-probe X-Ray Micro-Analysis; X-Ray Imaging Scan; SEM Scanning Electron Microscopy; etc. & more Failure-Analysis methods/techniques to Root Cause. ♦ Research new SmartPhone Battery technologies via interaction w/ OEM R&D & Materials Depts. to investigate/test feasibility of next-gen battery NanoMaterials SolidMetals SolidState-Electrolytes Glass-Electrolytes Liquid-Aqueous-Ion-Metals Ceramic-Polymer-Hybrids & Exotic-Additives/Compounds of new novel ingenious combos of Elements Materials TestMethods AssemblyMethods & Technologies [Dry-Battery-Electrode Solid-State-Battery Liquid-Electrochemical-Battery 3D-Si-Lithium-ion-Battery Glass-Battery Faraday-Super-Capacitive-Battery (for High-Energy-Density) Adaptive-Charging Inductive-Charging Coulombic-Efficiency High-Precision-Coulomerty Micro-Calorimetry Storage-measurements Impedance-measurements Super-Faraday-Capacitance-measurements] while supporting Mfg Teams in design tool-selection & Verify/Validate/Qualify custom equip for HighVolume Mfg to advance Art Knowledge Applicability Development Sustainability & Mfg of OEM Battery Cell Storage Tech in order to accelerate next-gen Battery Cell Mfg to “Max Battery Lifetime” “Min Battery Charge-Time” & “Max Energy-Density” in terms of “Watt-hour/(kg-dollar)”. ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Sr. Manufacturing Test Failure-Analysis Engineer – SmartPhone & Wearables @ OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, New York, United States ► Sr. Technologist - Reliability Test-Ecosystem Quality Failure-Analysis Data-Analytics Engineer+Manager for major Smartphone OEM (via PRO-DATA, INC. - Engineering Solutions) ► Sr. Consultant Liaison between (local US-based) OEM QA Engineers, Product Managers, Release Engineers, HW/SW Design Teams & (overseas WorldWide) remote Mfg. Operations teams. Excellent Project Mgmt. & People Mgmt. skills working w/ diverse groups @ multiple OEMs' WW geographic locations & Mfg Operations for OEM Smartphones & wireless products in ... Bangladesh, China, India, Indonesia, Japan, Malaysia, Mexico, Philippines, Singapore, S. Korea, Taiwan, Thailand & Vietnam. ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Sr. Mechanical Reliability QA/QC FA Engineer; SmartWatch Battery Camera-Mod OLED-Display @ OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, New York, United States ► Sr. Mechanical / Reliability / Quality / Failure-Analysis Engineer - Reliability Test-Ecosystem QA QC Failure-Analysis Data-Analytics Engineer+Manager for major OEM's Wearable Devices’ Smart Watches & Wearable Gadgets & Wireless Products & Wearable Technologies’ Batteries OLED-Displays Camera-Modules (via PRO-DATA, INC. - Engineering Solutions) ► Sr. Consultant Liaison between (local US-based) OEM QA Engineers, Product Managers, Release Engineers, HW/SW Design Teams & (overseas WorldWide) remote Mfg. Operations teams. Excellent Project Mgmt. & People Mgmt. skills working w/ diverse groups @ multiple OEMs' WW geographic locations & Mfg Operations for OEM Smartphones & wireless products in ... Tokyo, Japan; San Jose, CA; Frankfurt, Germany; Taipei, Taiwan; China, Thailand & South Korea. ♦ Sr. Consultant Lead Engineer w/ expertise in design/test/analysis of small Wearable Device tech products (with Mfg. ops in ... Tokyo, Japan; San Jose, CA; Frankfurt, Germany; Xiamen & Xiaogan & Zhuhai-Hongqi & Zhuhai Free Trade Zone, China; Taipei, Taiwan; Amphur-Wangnoi-Ayutthaya & Amphur-Uthai-Ayutthaya, Thailand; & Gyeonggi-Do, South Korea). ♦ Explored & led designs of new technologies integrated into watches & accessories as part of a joint project team. ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### Sr. Lead Reliabilty Test Failure-Analysis Engineer – SmartPhone & Wearables @ OEM @ ► SmartPhone & Smart-Wearable OEMs (via PRO-DATA, INC. - Engineering Solutions) Jan 2009 – Present | New York, NY ► Sr. Lead Reliabilty Test Failure-Analysis Engineer ♦ Implement JEDEC, ASTM & other industry standards ♦ Hands-on experience with Reliability Test & DOE/FMEA tools ♦ Failure Analysis via Surface Analysis & Chemical Detection (X-Ray, CT, SEM/EDS, FTIR, XPS, C-SAM) ♦ Proficiency in statistical analysis ♦ Leader in Laboratory, Manufacturing & R&D Experimental support ♦ Led & executed mechanical & environmental Reliability Tests (e.g., shock, drop, vibration, thermal cycling) ♦ Prepared detailed test plans & reports ♦ Conducted statistical data analysis for reliability risk assessments ♦ Performed Failure Analysis to determine root cause using X-ray, SEM/EDS, FTIR, and Microscopy ♦ Developed new test procedures and specifications to assess technology robustness ♦ Provided design recommendations to improve reliability ♦ Directed cross-functional teams (RE, PD, SQE, etc.) to communicate test results & findings ♦ Conducted Research on Technologies to predict failure modes ♦ Applied & Implemented documentation, test & safety standards ♦ Prepared detailed & accurate test reports for Technologists Engineers Scientists, Upper & Executive Management ♦ Directed engineers & vendors to execute reliability tests according to established test plans & deliver timely results ♦ Led in Failure Analysis investigations ♦ Directed CM Vendors overseas to calibrate & maintain reliability & mfg. facilities as well as to resolve technical challenges ♦ Directed lab logistics, including inventory management and organization ♦ See Résumé @ FEATURED section above ♦ www.pro-data.us ### SHPE – Corporate Relations Officer @ Society of Hispanic Professional Engineers, Silicon-Valley Chapter Jan 2007 – Present | Silicon Valley, CA ► SHPE Silicon Valley, Corporate Relations Officer ♦ SHPE-SV Representative generating leads and sponsorships with high-tech Corporate clients throughout Silicon Valley, CA, in support of SHPE's drive to plug the drop-out leak in American schools, turn this trend around, and provide Corporate America, with an ample supply of top-tier, highly talented, highly qualified, under-represented minority professionals in Science, Technology, Engineering and Mathematics (STEM), and in the process help America regain its competitive edge in the world. ♦ Generating leads and opportunities for High School, Undergraduate, Graduate & Post-doc Students in the form of Internships, Grants, Scholarships, and Research Fellowships in Science, Technology, Engineering and Mathematics (STEM) from sponsorships with high-tech Corporate clients throughout Silicon Valley, CA, such as: AMD, APPLE, Cisco, Citrix, Dell, E-Bay, Facebook=META, GOOGLE, Hewlett-Packard, Intel, Lockheed-Martin, Microsoft, Motorola, NanoSolar, Nextel, Northrop-Grumman, NVIDIA, Open.AI, Samsung, SolarCity, SpaceX, TESLA Motors, Yahoo!, YouTube, etc. etc. etc. and a multitude of other high-technology corporations, ventures and start-ups. ♦ Staying on top of latest Engineering Technology via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ https://shpe-sv.org ### TESLA – E.V. Automotive and Battery Manufacturing Lead for all Models: "S-3-X-Y" @ Tesla Jan 2020 – Jan 2020 | Fremont, California, United States ► Here is my Contribution and "Added Value" to the "S-3-X-Y" line-up of TESLA E.V. Automobiles & Batteries ... ♦ TESLA Model-S: Production Lead for Model-S BIW: Body-in-White, RUB: Rear-Under-Body manufacturing and Battery manufacturing. Was a "Team Asset" in breaking 2 production records, 2 days in a row, back-to-back, on Mon. & Tues. Dec. 07 ~ Dec. 08, 2020, in-keeping with the increased "Demand" of the "Christmas/New Year's Holidays 2020" surge in Production Orders for the Model-S vehicle. ♦ TESLA Model-3: (Also known as Model-E) Production Lead for Model-E BIW: Body-in-White, CUB: Center-Under-Body manufacturing and RUB: Rear-Under-Body manufacturing. ♦ TESLA Model-X: Production Lead for Model-X BIW: Body-in-White, CUB: Center-Under-Body manufacturing and RUB: Rear-Under-Body manufacturing. ♦ TESLA Model-Y: Production Lead for Model-Y BIW: Body-in-White, CUB: Center-Under-Body manufacturing, UBML/UBMR: Under-Body-Manufacturing Left/Right and BSIL/BSIR: Body-Side-Inner-Left/Right manufacturing. Also suggested and implemented a handful of EHS safety improvements, as well as several manufacturing efficiency improvements, to various Model-Y BIW: Body-in-White production areas. ♦ See Résumé @ FEATURED section above ♦ www.TESLA.com ### LOCKHEED-MARTIN – Sr. Systems Integration & Test Engineer, Staff Lead (IV) @ ► Lockheed-Martin Space Systems Jan 2006 – Jan 2008 | Sunnyvale, CA, USA ► Sr. Systems Integration & Test Engineer, Staff Lead (IV) CTC: Certified Test Conductor ♦ Executed electronic & electro-mechanical tests in various environments for many programs in the Flight Hardware Avionics Test Functional Qual Lab w/ 55+ team members; WORKED 80~100+ HRS/WK EQUAL TO ~5 YRS EXP ♦ Completed Functional V&V&Quals on 59+ units of Space Flight HW valued @ +$775M ♦ Liaison between Lab Engineers/Techs vs Program/Design/SMEs/Systems/Product/QA-Engineers/Managers & DoD Customers USAF/USN/NOAA/NASA/DCMA to: plan/implement/document/report custom designed/developed tests for Components/PCBs/Subsystems/Systems; Review/Approve test procedures; Balance conflicting demands of schedule/cost/test-efficiency; Verify accurate data/measurements; Analyze/Report/Troubleshoot/Fix anomalies; Written/Verbal reports to Customers & Mgmt; Developed innovative tech solutions to highly complex problems requiring regular use of ingenuity/creativity for 100% Mission Success ♦ Assure Flight HW & Personnel Safety in Aeronautical/Astronautical/Aerospace/Military Spacecraft of many Programs: NOAA's TIROS Television Infrared Observation Satellite; ABL Boeing 747-400F YAL-1 Air-Borne Laser (MW-class Chemical Oxygen Iodine Laser (COIL) mounted inside modified Boeing 747-400F nose-cone) weapon system; AEHF Advanced Extremely High Frequency system satellite; GOES Geostationary Operational Environmental Satellite; GPS-III Global Positioning System satellite; NASA's ISS International Space Station; KEI Kinetic Energy Interceptor missiles; MUOS Mobile User Objective System satellite; NOAA's DMSP Defense Meteorological Satellite Program; SBIRS Space-Based InfraRed System satellite; THAAD Terminal High Altitude Area Defense missiles & radar & Special Programs (Top Secret spacecraft/satellites) ♦ Worked till end of 50 yr run of NASA/NOAA TIROS & DMSP satellite programs; downsized after 2 months of Obama winning Presidency ♦ See Résumé @ FEATURED section above ♦ www.LockheedMartin.com ### MICROJET TECHNOLOGIES – VP Director of Reliability QA Test Autopsy FA of IC-CELLs & ElectroMechanics @ ► Microjet Technology Co., Ltd. Jan 2002 – Jan 2006 | Hsinchu City, Taiwan, Taiwan ► Director/VP of Product QA Reliability Test Semiconductor-Failure-Analysis Engineering; report to Chairman/CEO ♦ Revamped MicroJet’s Product Reliability QA/QC org; Profit & Loss (P&L) & budgeting responsibility. Directed Reliability/QA/QC/Test/FA Org of 6 Mgrs & 65 employees: Scientists Engineers Techs & Operators. Proposed/Implemented Test Dept & many other improvements for QA Reliability & Yield-Rates of MicroJet thin-film CELLS & Products, internally & w/ Si-Semiconductor CMs Contract Mfg (TSMC & Foxconn=Hon-Hai Precision Ind) where Yield Rates & QA/Reliability improved in +2-years from ~40% to >90%; translating to cost reduction, increasing yearly revenue (& added profit) of +$35M/Yr, an achievement MicroJet couldn't do in the 6 years prior. ♦ Implemented QA/Reliability systems & tools, adding value to MicroJet’s Customers & generated competitive QA/Reliability excellence consistently across all Ops such that MicroJet is now #1 aftermarket supplier in Taiwan & Asia & Oceana in terms of QA/Reliability. ♦ 4-year commitment; Once I turned MicroJet into a profitable biz, returned back home to USA. ♦ Broad & diverse “hands-on” entrepreneurial responsibilities in Start-up Company JP in Taiwan. Involved w/ everything from Design (novel Patented products) to Engineering (set-up QA/Reliability Test FA Dept; Si/Product procedures; equipment) to Operations (Logistics Materials-Procurement Production Shipping) to Finance (Angel-Investor-courting Budgets Grant-Proposal-Writing) to Management (Business-Plan Plant-Maintenance Labor) to IT (Network-set-up & Infrastructure). Provided Business QA Technical & Leadership experience for intro of a new series of novel & highly innovative Patented products which are 2nd-to-none, into European Asian & USA markets. Just-Print patented products are rated the best & is the most successful refill kit manufacturer WorldWide in terms of Reliability QA & Robustness. ♦ See Résumé from FEATURED section above. ♦ www.microjet.com.tw/en ### AGILENT TECHNOLOGIES – Sr. Product & Semiconductor Reliability / Test / Quality Engineer @ Agilent Technologies Jan 2001 – Jan 2001 | Santa Clara, CA ► AGILENT TECHNOLOGIES is the “original” HEWLETT-PACKARD – a spin-off of HP ► Sr. Product & Semiconductor Reliability / Test / Quality Engineer ♦ Led teams in Rel/QA during Development of HP Server HW components assuring FIT/MTBF/RAS via a host of V&V/Qual Configuration Tests under various usage conditions, working w/ highly matrixed Cross-Functional org of experienced Intl. Techs/Sr. Engineers/Scientists ♦ Led & completed Intl. Mfg. Qualifications for HW/Rel/QA/Tests prior to market intro via V&V/Qual of Semiconductor Mfg. & Products built @ HP/Agilent in Taiwan/Singapore/Mslsysia ♦ Maintained/Managed/Adhered to tight Test/Cost Schedule meeting milestone goals for V&V/Qual; Led Rel/QA/HW/SW/R&D Teams, kept members focused & Management abreast of delays/issues/deviations; Suite of product family introduced in budget & ahead of schedule by 1.5 months, prior to competition ♦ Refer to Hewlett-Packard work highlights (below) for a prior Hewlett-Packard/Agilent Technologies work history ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ www.Agilent.com, Downsized within 3 days upon 9-11 event ### AGILENT TECHNOLOGIES – Sr. Manufacturing Process Engineer @ Agilent Technologies Jan 2000 – Jan 2001 | Palo Alto, CA, USA ► AGILENT TECHNOLOGIES is the “original” HEWLETT-PACKARD – a spin-off of HP ► Sr. Manufacturing Process Engineer ♦ Mfg support for Tachyon-IC 64-bit PCI-to-Optic SAS/PCIe 2.0Fibre-Channel GB/s Host Bus Adapters HBAs, PCB-level components, HP-Servers: SAN/InternetNetwork Servers, ProLiant Servers, 3PARstoreServ Servers, nonStop-Integrity Servers, 9000 Servers & BladeSystem Servers ♦ Led Engineering teams, Verify/Validate/Qualify PCB components for Product Rel/QA improving development & robustness of HBAs ♦ Led HBA reviews of Engineering Design Specs / Schematics / PCB-Layout / Bill-of-Materials / HW / SW / TestPlans / Test Execution / Facility-Resources / Data-Collection / Statistics-Analysis for Product Rel/QA V&V/Qual of prototypes in USA & built @ HP/Agilent in Taiwan / Singapore / Malaysia / Japan / China ♦ Published Construction / Failure / RootCauseAnalysis reports & Product Reliability /QA reports (with JEDEC MTBF FIT rates from PCB-level components) with findings from Product Qualification of new/upgraded HBAs ♦ Designed/Built 64-bit server test-beds saving ~$42K by not buying exotic SAN/Internet-Network-Servers for stressing HBAs in real-time by simultaneously varying: FibreOptic / I:O / Amperage / Voltage / Temp / %RH / Altitude / Vibe / EMC/EMI per Regulatory Compliance; Test Suite is now part of HP/Agilent’s V&V/Qual for new products developed prior to Market Intro ♦ Refer to Hewlett-Packard work highlights (below) for prior Hewlett-Packard / Agilent-Technologies work history ♦ Staying current of latest AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé from FEATURED section above ♦ www.Agilent.com, Downsized within 3 days upon 9-11 event ### HEWLETT-PACKARD – Sr. Reliability Test QA Engineer - New Product Introduction (NPI) @ HP Jan 1995 – Jan 1999 | HP-BCD: Hewlett-Packard Barcelona Division; Barcelona, SPAIN ► Hewlett-Packard - IPG: Imaging & Printing Business Group ► Sr Reliability / Test / QA Engineer - New Product Introduction (NPI) ♦ Developed/implemented novel unorthodox design concept of “Worse Casing” combined w AFR: “Annualized Failure Rate” during prototype development tests at HP-Barcelona; a new novel unconventional process/technique for delivering robust products to market fast; result was reduced AFR for DesignJet color Plotters down from 140% to 2.5% translating in savings (& thus added profit) of +$95M/Yr ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ www.HP.com ► Sr Manufacturing Process Engineer & Sr Product Reliability QA Test Engineer ♦ Agilent Technologies is the “original” Hewlett-Packard – a spin-off of HP ♦ Refer to Agilent Technologies work highlights (above) for a continuation of Hewlett-Packard/Agilent Technologies work history ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ www.Agilent.com, Downsized within 3 days upon 9-11 event ### HEWLETT-PACKARD – Sr IC NPI Test / Product Eng; Sr Reliability QA Test Eng; Sr Mfg Process Engineer @ HP Jan 1990 – Jan 1995 | Corvallis, OR, USA ► Hewlett-Packard - IPG: Imaging & Printing Business Group ► Sr. Semiconductor NPI Test Product Design Development Engineer & Sr. Product Reliability Quality Test Engineer & Sr. Manufacturing Process Engineer ♦ Coordinator for Qualification of Change: led efforts with HP's Development & Manufacturing teams to globalize HP's processes, procedures, protocols, methodologies, applications & manufacturing at 4 key international locations globally (Aguadilla, Puerto Rico; Dublin, Ireland; Singapore; and Johor, Malaysia). ♦ Applied strong technical knowledge and deep experience in IC Thin-Film Silicon semiconductor FAB (Class 10), 4", 6", 8" & 12" Si wafer processes (dry-etch & wet-etch), PVD (reactive or non-reactive), E-Beam evaporation, thermal evaporation, optical coating, contact metallization, metal liftoff, associated metrology, etc.; mechanical & electro-mechanical hardware/software (products as well as extremely high-volume manufacturing assembly lines, running 24/7) towards "localization" and "internationalization" to establish the architecture, processes, and tools necessary to localize Hewlett-Packard's Product's, Reliability, Quality and Manufacturing philosophy at multiple HP IC Thin-Film Silicon & high-volume manufacturing sites worldwide. ♦ Led Teams at HP from product concept/inception till product maturity running very high-volume mfg at multiple WW sites, these Team efforts contributed to overhead product/mfg cost reduction of ~80% translating to a WW savings & thus added profit of $3.88B/Yr for decades into the future. ♦ Primary author of patent of refill methods for InkJet Cartridges used in HP DeskJet Printers, MFP Printers & DesignJet Plotters. ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ www.HP.com ### HEWLETT-PACKARD – Product Reliability Test Quality Engineer @ HP Jan 1989 – Jan 1990 | Corvallis, OR, USA ► Hewlett-Packard - IPG: Imaging & Printing Business Group ► Product Reliability/Test/Quality Engineer ♦ HP Jornada Palmtop smart Wireless handhelds w/ LCD Touchscreen & Bluetooth connectivity; and their Thermal Printer Peripherals & Consumables ♦ Responsible for the Product-Process Qualification Phase for new manufacturing processes to be reviewed for acceptance, & assisted in documenting Environmental Impact Assessments for EPA of new surface-mount/wave-soldering/PCB-cleaning & Manufacturing processes transferred to HP Corvallis. Review performance specifications & test procedures for compliance with environmental qualification, HALT/HASS & performance requirements ♦ Perform work bench ESD validation & certification for Manufacturing areas ♦ Programmed X-Y-Z Pick-&-Place robots for Through-Hole as well as Surface-Mount Manufacturing equipment in a very high volume environment, building Logic & Memory PCBs for HP servers. ♦ PCB board bring-up and qualification of Logic & Memory electronics (DVT, EMI, EMC, HALT/HASS, burn-in, etc.) ♦ Custom designed & custom build Impact-Shock/Vibration testbeds using CADAM/CATIA & ME30 to test Field Replaceable Units & PCBs of for HP 9000 Enterprise & Integrity Superdome UNIX Servers assuring RAS ♦ Designed tooling/fixtures to improve Manufacturing Processes & Product Reliability/Quality saving HP Corvallis Division at least ~$1.65Million/Year ♦ Weekly meetings on productivity/quality improvements ♦ Verified coherency of programming code written by HP Computer Scientists ♦ Wrote Manufacturing & Test Procedures, qualified machines, trained operators, implemented cost effective ideas to improve Logic & Memory PCB Product Reliability & PCB Manufacturing Processes (wets & non-wets) ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ www.HP.com ### CAREER KNOWLEDGE CERTIFICATIONS COURSEWORK CREDITS LICENSURE PROFESSIONAL-TRAINING @ Skills Learned On The Job @ IBM HP Agilent-Tech MicroJet-Tech Lockheed-Martin & Pro-Data Inc. Jan 1925 – Jan 1925 | USA (OR, CA) EUROPE (Spain) ASIA (Taiwan, Hong Kong, China, Japan, Singapore, Malaysia) ► 2005 – Present ► UNITED STATES (Oregon, California); EUROPE (Spain); ASIA (Taiwan, Hong Kong, China, Japan, Singapore, Malaysia) ♦ Staying on top of latest key AI ML LLM & Engineering Technologies via various Courses & Certifications ♦ See Résumé @ FEATURED section above ► SKILLS ♦ Significant experience at Start-up organizations and well-established International Corporations as Sr. Lead Engineer & Project/Product Manager ♦ Significant experience on wide range of products: Handheld Wireless, LCD, PC Peripherals, PC Hardware/Software & Aerospace Flight Hardware ♦ Coding iOS C++ Objective-C Python Arduino Altino HTML MatLAB LabVIEW Solidworks Pro-E (iPhone iPad Android Tablet Mobile App Development) Flash JavaScript Reliability Quality Test Hardware Mechanical High Volume Manufacturing VLSI Silicon Finite Element Analysis (FEA) HALT HASS Aarrhenius Acceleration models MTBF FIT FMEA FFMEA Design of Experiments (DOE) CQE CRE Six-Sigma etc. ► SPECIALITIES ♦ Energizing Leadership ♦ Product Development ♦ Quality Control ♦ Test/Reliability/QA Engineering ♦ Thinking “Out of the Box” ♦ Excited about new Technologies ♦ New Venture Start-Ups ► GOALS ♦ Career as engaged contributor with a high growth visionary Organization offering development & stimulating assignments, allowing utilization of broad/diverse experience, qualifications, education, technical ability & people/leadership skills to bring highly innovative/robust Quality products/services to customers efficiently/successfully ♦ Opportunity w innovative high-tech products/services to improve Life, in harmony w Earth ♦ Promote Hawai'ian culture values & respect when working in unison towards a common constructive goal ♦ Community Leader promoting responsible stewardship/harmony between People & Nature, strengthening Hawai'ian cultural/spiritual connections ### QUALITY-ASSURANCE RELIABILITY TEST FAILURE-ANALYSIS STATISTICS METHODS SPECS & OTHER TECH @ Skills Learned On The Job @ IBM HP Agilent-Tech MicroJet-Tech Lockheed-Martin & Pro-Data Inc. Jan 1925 – Jan 1925 | USA (OR, CA) EUROPE (Spain) ASIA (Taiwan, Hong Kong, China, Japan, Singapore, Malaysia) ► 2005 – Present ► QUALITY-ASSURANCE / RELIABILITY / TEST / FAILURE-ANALYSIS / STATISTICS, METHODOLOGIES SPECIFICATIONS & OTHER TECH SKILLS ♦ Staying on top of latest key AI ML LLM & Engineering Tech via various Courses & Certifications ♦ See Résumé @ FEATURED section above ♦ ANSI Y14.5M: GD&T Geometric Dimensioning & Tolerancing [HP Trained] ♦ STANDARDS: ANSI ASTM CE EN IEC IEEE ISO JEDEC MIL-SPEC MIL-STD [HP Agilent LM Pro-Data Trained] ♦ ISO: 9000 9001:2008 10012 14000 18000 19011 etc. [HP Agilent LM Pro-Data Trained] ♦ REGULATORY LABS: UL NIST NRTL NSF-Intl [HP Agilent LM Pro-Data Trained] ♦ Analysis/Design of Electromechanical Assembles Systems & Networks [NJIT-Edu HP-Trained] ♦ Analysis/Design of Dynamic Nano/MEMS Systems [NJIT-Edu HP-Trained] ♦ RELIABILITY: Weibull, Pareto, Gaussian, Trend / Control Charts, Cp / Cpk, 6M, 5Y, etc [NJIT-Edu] ♦ Stage-Gate: Product Development Cycle [HP-Trained] ♦ QUALITY: Verify Validate Qualify Commission; URS: User Rqmnt. Specs: DQ IQ OQ PQ MQ CQ [HP Agilent Trained] ♦ FAILURE ANALYSIS: Sample preparation, Cross­Sectioning, Dye & Pry [Agilent HP MicroJet Trained] ♦ MTBF: Mean Time Between Failures; Failure Rate; Bathtub Curve [Agilent HP LM Trained] ♦ FIT: Failure in Time Rate – (FIT to MIL-HDBK-217F) [Agilent HP LM Trained] ♦ Root-Cause (Fall Out) Analyses / Fault Tree Analyses / Post-Partum Analyses [NJIT Edu] ♦ FISHBONE ANALYSIS: Cause & Effect Analysis (Ishikawa Diagram) [NJIT Edu] ♦ DATA-ANALYTICS / DATA-MINING: Tableau, Correlation Techniques; Factorial & Time Series Analysis [NJIT-Edu HP-Trained] ♦ DOE: Design of Experiments; Statistical Sampling Theory; Accelerated LIFE Test [NJIT-Edu] ♦ PDCA: Plan, Do, Check, Act; Kaizen Methods; Taguchi Methods [NJIT-Edu] ♦ LM21: Lockheed Martin’s Quality Assurance Program [LM Trained] ♦ 5s: Organizing Shared Workspace: Seiri, Seiton, Seisō, Seiketsu & Shitsuke [LM Trained] ♦ GAGE R&R “Repeatability & Reproducibility” = “Precision & Accuracy” [NJIT-Edu] ## Education ### ► Graduate Continuing Education in in "Engineering" & "Management of Technology" Stanford University ### Master of Science in Mechanical Engineering Albert Dorman Honors College at NJIT ### Bachelor of Science in Mechanical Engineering Albert Dorman Honors College at NJIT ### High School Diploma in College/University Preparatory and Advanced Magnet Honors High School Dr. Ronald E. McNair "Academic" High School ### ► High School Sophomore Year in College Preparatory Moanalua High School ## Contact & Social - LinkedIn: https://linkedin.com/in/rubenpena - Website: https://pro-data.us - Website: https://about.me/ruben.pena - Website: https://www.facebook.com/ruben.pena.2000 --- Source: https://flows.cv/rubnpea JSON Resume: https://flows.cv/rubnpea/resume.json Last updated: 2026-04-05