Innovative technology and engineering leader with over 15 years of experience in the semiconductor industry.

2025 — Now

2019 — 2025

Client and Enterprise SSD

Lead testing and productization of Gen 6/8 3D NAND for Client and Enterprise SSDs.

SSD and Mobile Memory Systems Design Validation

Led validation of SSD and mobile memory system firmware, overseeing low-level NAND sequences and feature bring-up.

Advanced Memory Group

Led testing and productization of Western Digital's first 4-bit per cell Gen 4 3D NAND, improving memory die quality and reducing test costs.

2017 — 2019

Advanced Memory Group

Developed test flows for automotive-grade NAND Flash memory on 64-layer TLC 3D NAND.

Client SSD Products

Designed test flow architecture for 64-layer TLC 3D NAND in SSDs.

2016 — 2016

Embedded Products

Led the bring-up of ATE test hardware and prototypes for SanDisk’s first UFS mobile product.

2013 — 2016

Embedded Products

Led the development of memory and system test flows for SanDisk's 15nm TLC Flash-based eMMC 5.0/5.1 products.

Boise State University

2006 — 2009

UCSC Silicon Valley Extension

2017 — 2017