• Lead a team of mechanical FEA engineers for the integration of Apple silicon into Mac and server products.

• Drive key package and system design trade-offs to meet stringent mechanical, thermal, reliability and other targets.

• Lead complex FEA-based simulations at chip, module and system-level; predict long-term performance under extreme operating conditions.

• Mechanical Design Lead for high-volume Data Center server components with over 20 Million units shipped.

• Owned architecture definition, detailed tolerance analysis, and final drawing release for critical components, ensuring adherence to strict quality requirements.

• Performed extensive FEA and led physical testing (shock, vibration, thermal cycling) to validate designs and drive parts quality with manufacturing vendors.

• Led thermo-mechanical FEA and validation testing, guiding package architecture, material selection, and predicting reliability performance for high-performance chips.

• Supervised and mentored junior engineers while defining, executing, and validating advanced reliability testing (shock, drop, TC, Vibe). Hands-on expert in structural/thermal characterization using Instron, DIC, accelerometers, etc.

• Partnered with global OSATs and Intel factories to execute qualification testing, solve field issues, and ensure a robust ramp into high-volume manufacturing (HVM).

• Developed experimental techniques to characterize mechanical and piezo-electric material properties.

• Perform failure analysis using advanced techniques such as SEM, AFM, FIB, optical microscopes.

• Measured the mechanical damage on magnetic heads using tools such as AFM, TEM and nano Auger.

• Correlated the media disk defect geometry to electrical degradation of the computer hard drives.