Led a cross-functional team driving strategic transformation programs in sales and marketing domains, supporting Intel's SAP S4 transformation and IT's enterprise compliance initiatives.

• Delivered an AI "intelligent support" agent, enhancing customer experience through AI assisted support resulting in a 20% reduction in call center support cases in the first six months of deployment.

• Achieved $400M cost savings through elimination of legacy tech debt and maintenance, enhancing overall enterprise and financial performance.

• Spearheaded integration of AI-driven solutions in consumption data analytics, leading to data quality improvements which resulted in a 30% reduction in data mining and analysis cycle times, leading to faster pricing, product mix and capacity plan decisioning.

• Coordinated and led disposition of ~100 enterprise applications in sales operations and supply chain – Performed fit-gap and business process/technical design readiness assessments as part of Intel’s SAP S4 migration plan.

Led a global matrixed team of Sales, Marketing and Supply Chain leads responsible for pre-sign due diligence and execution of integration and separation plans for over ~30 M&A deals considering global tax and trade regulations, legal entity structure, and compliance with local laws and company policies. Acted as the primary liaison between Finance, IT, Legal, CQN, HR and Corporate Services to ensure seamless integration of sales and supply chain people, processes and platforms.

• Designed and ratified integration/separation strategy and coordinated plan execution across sales and supply chain workstreams, mitigating business disruption and transition risk while accelerating synergy capture.

• Drove cross‑functional harmonization of policies, product brand and category strategies, customer success and supplier governance frameworks across newly combined business units.

• Negotiated strategic customer and supplier transitions and contract novation during integration, securing business continuity while ensuring compliance with contract terms and conditions, mitigating risk while driving cost reductions across priority categories.

• Spearheaded E2E Lead to Cash master data, system and business process integrations, mapping legacy processes to future‑state workflows to drive operational efficiency and eliminate redundant tech and operations debt.

Delivered executive aligned, five-year demand and capacity planning signal for external silicon foundries and packaging assembly-test, informing $B-level capital decisions.

• Designed and implemented scenario forecasting models, balancing market competitiveness, cost of sales, and fab capacity, improving strategic planning and sku-mix-volume decision making.

• Consulted on product roadmap strategy, securing alignment between marketing, manufacturing, and engineering divisions, guiding scenario planning cycle times down from three days to one day.

Hired, trained and managed diverse global engineering and analysis team responsible for developing thermal-mechanical design guidance for Intel's microprocessor platforms, enabling customer design teams with cooling and structural recommendations scaled to meet device performance requirements.

• Collaborated with micro-architecture planning teams to define performance and thermal design KPIs for mobile and client devices, expanding market reach for high performance and low power processors.

• Guided design, materials procurement, and manufacturing of Intel's first reference tablet platform, launched within six months of concept.

• Reference design, and supporting design rules, enabled traditional PC clients entering small form-factor mobile markets, helping secure ~20% tablet MSS.

Engineered thermal‑solution designs for PC client devices, directing both a thermo‑mechanical analysis team and a lab‑tech organization to deliver high‑performance, manufacturable solutions.

• Improved board test throughput and software load efficiency by implementing quick‑attach thermal mechanisms; awarded U.S. Patent #6741470 for a reusable thermal‑solution attach design.

• Authored global test protocols, capability assessments, and technical reports across U.S., Europe, and APAC sites, strengthening consistency and rigor in PC client thermal validation.

• Built and delivered customer‑focused thermal engineering training for new product designs, enabling performance optimization, BOM efficiency, and faster adoption of design best practices.