San Francisco, California, United States
• Owned the mechanical design for the Gen 2 and Gen3 platform involving light-pipes, interconnected PCBs, current and voltage sense clips, thermal management strategies, EMI management and complex harness designs within tight volumetric constraints.
• Responsible for mechanical and thermal packaging for GEN3 modular products by delivering mechanical architecture with an optimized assembly integrating busbars and PCB housing that met certification (UL, NEC, FCC), automation, and reliability standards.
• Designed complex electromechanical assemblies integrating sheet metal, heatsinks, plastics, high voltage connectors and busbars with intricate tolerance stacks; partnered closely with manufacturing vendors and quality teams to optimize processes and maximize production yields.
• Experienced in DFM, DFA, statistical tolerance analysis and geometric tolerancing for high volume manufacturing in China and Mexico. Conducted several RCAs using 8D principles, DOEs to resolve manufacturing issues and worked with vendors to bring processes under control.
• Managed programs, mentored interns, functioned as a technical leader, and collaborated with cross-functional teams, including Reliability, Certification, Quality, Thermal, Electrical Hardware Engineering and Operations to deliver projects under tight deadlines.