# Wayman Lee > Senior Product Design Engineer at SunPower Corporation Location: Los Altos, California, United States Profile: https://flows.cv/waymanlee ## Work Experience ### Senior Product Design Engineer @ SunPower Corporation Jan 2011 – Present | San Jose, CA ### Senior Product designer @ Solyndra Jan 2008 – Jan 2011 | Milpitas, CA Responsible lead product design engineer for next generation Solyndra solar panel design. New design increased power output by 15% while reducing part count and cost by 30%. New design also decreased installation time in half. Worked closely with manufacturing engineering to develop processes and procedures for new design. Lead designer for Solyndra panel shipping crate that reduced crate cost by 50%. Responsibilities include coordinating tooling, scheduling, and testing activities. ### Mechanical Engineer @ Infinera Jan 2002 – Jan 2008 | Sunnyvale,CA Responsible for the mechanical aspects of PCB and optical line cards designed to blind mate into a long haul transport rack mount telecom chassis. Designs include sheet metal enclosures and carriers, PCBs, and heat sinks. Also worked extensively on optical component mounting and internal and external fiber routing, including fiber trays and fiber radius guides. Other activities include documentation, tolerance analysis, cable design, NEBS GR-63 compliance, industrial design, EMI shielding design and developing initial optical and splicing procedures working in conjunction with manufacturing engineering. ### Mechanical Engineer @ CoSine Communications Jan 2000 – Jan 2002 | Redwood City, CA Responsible for the design of sheet metal and plastic components of rack mounted chassis enclosures. Led the development of a 13u, 8 slot system in conjunction with a 3rd party contract firm. Directed the activities and worked closely with the contractor on all mechanical and industrial design aspects of the chassis. Also a key member of a team to design a 21u, 26 slot system and a 3u system. Other activities included tolerance analysis, heat sink mounting clip design, and EMI shielding of PCB components. ### Product Design Lead @ Sun Microsystems Jan 1997 – Jan 2000 | Menlo Park, CA Mechanical lead of a product design team responsible for all aspects of designing plastic and sheet metal workstation parts and housings. Functions include optimization of manufacturability, tooling, serviceability, ergonomics, esthetics, EMI shielding, safety, and thermal cooling of a product. Other activities include tolerance analysis of mechanical features and documentation. Worked closely with other projects and divisions within Sun to allow them to leverage designs done within our group. ### Product Design Lead and Packaging Engineer @ Apple Inc. Jan 1986 – Jan 1997 | Cupertino, CA Product Design Project Lead and Engineer: Project lead of a product design team responsible for all aspects of designing plastic and sheet metal parts and housings. The product design team functions include optimization of tooling, manufacturability, serviceability, ergonomics, esthetics, EMI shielding, safety, and thermal cooling of a product. Other activities include vendor selection, tooling quotations, tolerance analysis, and documentation. Also responsible for all phases of the implementation of a new design: includes coordination and managing worldwide deployment of tools and parts and working closely with vendors and manufacturing to insure the smooth transition of a design. Packaging Engineer: Responsible for design, test, documentation, and implementation of shipping containers for Apple service modules. Established a packaging program in which 69% of service modules were consolidated into 6 standard packages. Determined packaging requirements for PCBs, floppy and hard disk drives, power supplies, printer components, keyboards, and CRTs. Tested package designs extensively on shock and vibration testers. Worked closely with vendors to develop packaging and obtain quotes. Also worked with line supervisors to develop manufacturing layouts and time standards for the packaging line. Developed a barcode labeling system for package identification labels. Determined label formats and layouts, programming requirements, and selection of vendors and equipment. ## Education ### BS in Engineering Technoloy California Polytechnic State University-San Luis Obispo ## Contact & Social - LinkedIn: https://linkedin.com/in/wayman-lee-b335043a --- Source: https://flows.cv/waymanlee JSON Resume: https://flows.cv/waymanlee/resume.json Last updated: 2026-04-13