# William Huang

> Software Engineer @ JPMorganChase

Location: New York City Metropolitan Area, United States
Profile: https://flows.cv/williamhuang

Always down to chat.

## Work Experience
### Software Engineer II @ JPMorgan Chase & Co.
Jan 2024 – Present | New York City Metropolitan Area
Agentic AI

### Software Engineer @ Lincoln Financial Group
Jan 2022 – Jan 2023
Devops

### Software Engineer Intern @ Crane Payment Innovations
Jan 2021 – Jan 2021 | Malvern, PA
Devops


## Education
### Bachelor's degree in Information Science & Technology
Temple University


## Contact & Social
- LinkedIn: https://linkedin.com/in/williamhuang3

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Source: https://flows.cv/williamhuang
JSON Resume: https://flows.cv/williamhuang/resume.json
Last updated: 2026-04-05