• Developing the cutting-edge next-generation DML/EML/ SiPh PAM4 optical transceiver modules for 5G and data-center applications.

• As a project design lead, achieved single-wavelength 100G design win within 4 months, prototyping & real-time demo within 8 months, product sampling within 18 months, and volume production within 30 months.

• Developed and delivered >=2 commercial products that contributed to the company’s revenue.

• Led R&D projects, patent filings and publications.

• Reporting to CEO and VP.

• Worked on the design, tapeout, testing and R&D of coherent transceivers using silicon photonic integrated circuit for the 100G, 400G and 1T bit speed fiber optic transmission for interconnecting data center, metro, long-haul and ultra-long haul telecommunication networks.

• Reported to Dr. Chris Doerr and Dr. Long Chen.

• Worked in the Large Scale Integrated Photonics group (LSIP) at HP Labs, with the main research topic of silicon photonics and the long-term goal of achieving a low-power consumption, high-speed photonic interconnect system for HP data center business.

• Participated in design, fabrication, and characterization of Si-based photonic integrated component and circuits, including high-speed optical modulators, avalanche photo detectors, and polymer/MEMS based devices.

• Worked in packaging and PCB technology group, addressed package/Module design and Signal/Power integrity challenges in 25G and beyond designs for high end microprocessors as well as ASICs; Involved with End-to-End power integrity and channel analysis including I/O, Pkg, backplanes, etc.

• Used analytical and simulation tools (e.g. ANSYS HFSS) to define package/module design requirements in the project conception stages, simulated multi-signal package/module models over 50 GHz bandwidth and develop suitable test structures for model to measurement correlation; mixed mode theory on differential transmission line.

• 4-port on-wafer calibration using SOLT method, validation, and measurement of differential transmission line on bump and BGA sides of Oracle’s recent series of ceramic package. 1mm pitch probe calibration and measurement on BGA.

• Participated IBM 2008 Blue Pathway Internship Program, worked in Global Technology Service Department; contributed to the project of “Beijing Chaoyang District Digital Video Surveillance System”, which served for Beijing 2008 Olympic Games and Paralympic Games.

• Assisted to complete the development work of Geographic Information System (GIS), accomplished the work of GIS optimization, system testing and maintenance; worked in core computer room to guarantee the normal operation of all the core system devices;

• took charge of training and guiding the DVS users in Chaoyang District, provided specific consultation and technical support to users

• Joined IBM technical trainings; studied several IBM technologies, such as J2EE, SOA, Cloud Computing, and understood some knowledge about the operating system software, database management software and system development software