# Xingyu Z. > . Location: United States, United States Profile: https://flows.cv/xingyuz (Updated on 2021) • Startup and entrepreneurial experience of bringing integrated photonics from conception to production stage. Extensive understanding of full product life cycles. Completed several design cycles, and delivered several commercial 100G/200G/400G/800G/1.6T products to customers in mass volume that have contributed to revenues. Two successful startup exit experiences, including IPO in 2016 and acquisition in 2021. • Background in optics, integrated photonics, RF, and semiconductors • Design and modeling of Si, SiN, Silica, Polymer, III-V, and hybrid integrated active/passive photonic devices and subsystems: photonic integrated circuits, high-speed coherent/PAM4/NRZ optical transceivers, modulators, photodetectors, MUXs/DEMUXs, WDM, hybrid tunable lasers, optical phased array antennas, Lidar, optical sensing, optical computing, etc. Familiar with multivariable optimization and inverse design. • Layout of complex large-scale photonic integrated circuits, PDK, DRC, etc.; 15+ full tape-outs within tight schedules; familiar with 6+ photonics foundries. • 5 years’ hands-on cleanroom fabrication & process experience; interface with CMOS/MEMS foundries for process development and support volume production. • Hands-on laboratory experience in die-level/wafer-level testing of passive/active optical/RF devices, tester automation, and test plan design; 100Gbps+ electrical/optoelectronic measurement; S parameters, eye diagrams, BER tests; Experienced in instrumental control and debug using Python, Matlab, C#, etc; test bench design and build. • Data analysis experience: wafer/wafer and lot/lot data collection and analysis, histogram/wafermap plots, yield analysis, die sorting and binning, database • Knowledge in electrical/optical packaging, signal integrity, thermal/stress/moisture modeling; optical module assembly, BGA packages, MCM, 2.5D/3D packaging, hybrid integration; prototyping; pluggable modules. • Familiar with reliability evaluation, accelerated stress test, damp heat, HTOL, failure analysis, etc. • Computer languages: C, C++, C#, MATLAB, Python, LabVIEW; Software: Lumerical, COMSOL, ANSYS HFSS, Synopsis, Photon Design, Luceda, IPKISS, Nazca, AutoCAD, SolidWorks, LinkCAD, Cadence, Mentor Graphics, Calibre, Klayout, Ledit, JMP, OpenCV, OpenGL • > 50 (>35 first-authored) publications, including invited papers, Best Papers, OFC postdeadline papers, with > 1700 citations. • > 30 patents granted, filed, or in progress. ## Work Experience ### Principal Engineer of Transceiver Development @ Alpine Optoelectronics, Inc. Jan 2018 – Present | Fremont, California, United States • Developing the cutting-edge next-generation DML/EML/ SiPh PAM4 optical transceiver modules for 5G and data-center applications. • As a project design lead, achieved single-wavelength 100G design win within 4 months, prototyping & real-time demo within 8 months, product sampling within 18 months, and volume production within 30 months. • Developed and delivered >=2 commercial products that contributed to the company’s revenue. • Led R&D projects, patent filings and publications. • Reporting to CEO and VP. ### Senior Photonics Integrated Circuit Design Engineer @ Acacia Communications Inc. Jan 2015 – Jan 2018 | Greater New York City Area • Worked on the design, tapeout, testing and R&D of coherent transceivers using silicon photonic integrated circuit for the 100G, 400G and 1T bit speed fiber optic transmission for interconnecting data center, metro, long-haul and ultra-long haul telecommunication networks. • Reported to Dr. Chris Doerr and Dr. Long Chen. ### Postdoctoral Research Scientist in Large Scale Integrated Photonics @ Hewlett-Packard Jan 2015 – Jan 2015 • Worked in the Large Scale Integrated Photonics group (LSIP) at HP Labs, with the main research topic of silicon photonics and the long-term goal of achieving a low-power consumption, high-speed photonic interconnect system for HP data center business. • Participated in design, fabrication, and characterization of Si-based photonic integrated component and circuits, including high-speed optical modulators, avalanche photo detectors, and polymer/MEMS based devices. ### Hardware Engineer Intern @ Oracle Jan 2014 – Jan 2014 | San Diego, CA, USA • Worked in packaging and PCB technology group, addressed package/Module design and Signal/Power integrity challenges in 25G and beyond designs for high end microprocessors as well as ASICs; Involved with End-to-End power integrity and channel analysis including I/O, Pkg, backplanes, etc. • Used analytical and simulation tools (e.g. ANSYS HFSS) to define package/module design requirements in the project conception stages, simulated multi-signal package/module models over 50 GHz bandwidth and develop suitable test structures for model to measurement correlation; mixed mode theory on differential transmission line. • 4-port on-wafer calibration using SOLT method, validation, and measurement of differential transmission line on bump and BGA sides of Oracle’s recent series of ceramic package. 1mm pitch probe calibration and measurement on BGA. ### IT specialist Intern @ IBM Jan 2008 – Jan 2008 | Beijing, China • Participated IBM 2008 Blue Pathway Internship Program, worked in Global Technology Service Department; contributed to the project of “Beijing Chaoyang District Digital Video Surveillance System”, which served for Beijing 2008 Olympic Games and Paralympic Games. • Assisted to complete the development work of Geographic Information System (GIS), accomplished the work of GIS optimization, system testing and maintenance; worked in core computer room to guarantee the normal operation of all the core system devices; • took charge of training and guiding the DVS users in Chaoyang District, provided specific consultation and technical support to users • Joined IBM technical trainings; studied several IBM technologies, such as J2EE, SOA, Cloud Computing, and understood some knowledge about the operating system software, database management software and system development software ## Education ### PhD in Electrical Engineering The University of Texas at Austin ### Master's degree in Electrical and Electronics Engineering University of Michigan ## Contact & Social - LinkedIn: https://linkedin.com/in/xingyu-z-11740952 --- Source: https://flows.cv/xingyuz JSON Resume: https://flows.cv/xingyuz/resume.json Last updated: 2026-04-12