• iOS hardware test design lead, working on next generation products from first prototype to mass production.

• Cross-functional team leadership for engineering bring-up, local validation, testing and factory line manufacturing in all prototype stages of a consumer device.

• Responsible for the development of test procedures, test plans and reporting results with next steps to executive management.

• Contract manufacturing/vendor interfacing and direct supervision on all component-­level test fixtures, as well as all final assembly (in-­system) testing of modules, and system software.

• Technical management of test coverage, test fixture design and improvement, test optimization, factory process control and iOS readiness and control.

Diagnostic Support for the Kindle mobile device

China Factory Production Line support

Memory qualification

Responsible for memory qualification.

• -Define the process, work with China, India team, drive and execute the plan,

• -Work with memory vendors, solid relationship with Samsung Memory, Micron, Hynix

• -Jointly deliver the Timing/Signal Analysis, identify the possible JEDEC spec out, and drive the system platform resolution.

• -Provide DDR calibrate tool.

• -Deliver the software as a total solution.

USB Production Support./WHQL certification

• -Setup from scratch and deliver the end-to-end solution.

• -Highlights: first to deliver the WHQL certificate for cellular BU.

AE Chipset Lead for dual A9 product

• -Start from concept approval phase, lead customer requirement analysis across Marketing, ASIC, System Architecture, Software, Hardware groups.

Customer support, such as Samsung. Especially, support China customers such as TCL. Many on-site supports with international travel.

BSP Chip Firmware Group.

As the second member, team had grown more than 10 engineers. Support important customer such as Nokia and Samsung.

1. Drivers/Board Support Package Development.

Worked on the following drivers: SIM/USIM(2G, 3G), I2C, SD/MMC, SPI with ARM PrimeCell, TVOUT, DMA with ARM PL089, Keypad/ GPIO, Interrupt Controller

Highlights: first to implement and pass all 3G USIM GCF Electrical tests with 3GPP.

2. Responsible for the Security features for the new line of chip-sets. Such as OTP, SHA1, SHA2, HMAC, AES, DES, Secure JTAG, memory scrambler, secure RTC. PKE.