One of the first 3 founding team to start this company.
• Defined and negotiated 100G/400G/800G product specifications with strategical customers.
• Architected and specification definition, supervised IC design team to design 200Gbps optical front-end ICs, EML/Silicon-Photonics driver and linear TIA circuits.
• Created the in-house pre-Silicon verification check-list process and post-Silicon DVT test environment and auto-characterization procedures.
• Built-up a solid high-speed IC package backend design team. Hands-on experiences in setting up 3D EM simulation, using CST or ADS, in high-speed module package design.
• Designed 50GbE QSFP-28/56 optical module reference design for customer demonstration.
• Designed 800Gbps COB optical front-end module with TEC controller and control circuits for customer evaluation.
• Design the silicon photonics based linear modulator driver and TIA array customer LiDAR demo Eval-KIT (FMCW detection scheme) interfacing with FPGA.
• Built-up a high-speed IC EVT/DVT/production team with in-house wafer level and packaged device level ATE fixtures.
• Developed a SQL based database server for device manufacture data storage and traceability.
• Built-up an IC reliability test lab for IC qualification process and device FITS calculation.
• Outsourcing vendor engagements: GaAs and BiCMOS foundries, package and assembly houses, key components vendor selections, including wafer foundries and No.1 and No.3 OSATs in the world.
• Customers application engineering engagements, including reference design, documentation generation and problem-solving, etc.