One of the first 3 founding team to start this company.

• Defined and negotiated 100G/400G/800G product specifications with strategical customers.

• Architected and specification definition, supervised IC design team to design 200Gbps optical front-end ICs, EML/Silicon-Photonics driver and linear TIA circuits.

• Created the in-house pre-Silicon verification check-list process and post-Silicon DVT test environment and auto-characterization procedures.

• Built-up a solid high-speed IC package backend design team. Hands-on experiences in setting up 3D EM simulation, using CST or ADS, in high-speed module package design.

• Designed 50GbE QSFP-28/56 optical module reference design for customer demonstration.

• Designed 800Gbps COB optical front-end module with TEC controller and control circuits for customer evaluation.

• Design the silicon photonics based linear modulator driver and TIA array customer LiDAR demo Eval-KIT (FMCW detection scheme) interfacing with FPGA.

• Built-up a high-speed IC EVT/DVT/production team with in-house wafer level and packaged device level ATE fixtures.

• Developed a SQL based database server for device manufacture data storage and traceability.

• Built-up an IC reliability test lab for IC qualification process and device FITS calculation.

• Outsourcing vendor engagements: GaAs and BiCMOS foundries, package and assembly houses, key components vendor selections, including wafer foundries and No.1 and No.3 OSATs in the world.

• Customers application engineering engagements, including reference design, documentation generation and problem-solving, etc.

• 100Gbps Si-Photonics QSFP-28 optical modules.

• 100Gbps Gearbox ICs.

• 10Gbps tunable optical communication modules.

• Responsible for the GMS/GPRS phone module reference design.

• Responsible for the GSM/GPRS phone module Full-Type Approval certification process.

• Responsible for the phone module design and verification test and product specification generation.