Intel Technical Leadership Program. N3/N5/N7/N12/N16 NPI Foundry Engineering. Multi Foundry Management. Advanced FinFET Technology Nodes (TSMC, Samsung, GlobalFoundry). Flagship Chiplet Product PPV Binning. Design PPA Enablement. Device Engineering. NPI Products. Silicon Product Yield Ramp. High Volume Production. Product Yield Improvement. Failure Analysis.

Multi-sourcing Foundry Development, Semiconductor Foundry Operations, Semiconductor Commodity Supply Chain, Semiconductor Technology Integration, IP Characterization, Silicon Validation, Semiconductor Product Qualification, Semiconductor Product Quality Reliability, Semiconductor Product Yield Engineering, Device Engineering, Packaging QA

Multi-sourcing Foundry Development, Technology Transfer, Design Ennoblement, Manufacturing Operations, Product Qualification, Design Support, Yield Enhancement

Xilinx Semiconductor

Device Characterization, Model Extraction, FEOL & BEOL Models, 3D Interposer TSV, Analog Device, RF, Transmission Line & Inductor Models

Xilinx Semiconductor

Device Engineering, Device Reliability, Product Qualification